device n. 1.设计,计划;方法,手段。 2.〔pl.〕意志,欲望。 3.谋略,策略,诡计。 4.器具,器械,设备,装置。 5.图案,图样;花样;纹章;标记,商标;(纹章上的)题铭。 a safety device 安全设备。 a pressure device 压力计。 a homing device 自动寻的[导引]装置。 leave sb. to his own devices 让某人自行其是。
process n. 1.进行,经过;过程,历程;作用。 2. 处置,方法,步骤;加工处理,工艺程序,工序;制作法。 3.【摄影】照相制版法;照相版图片;三原色印刷。 4.【法律】诉讼程序;法律手续;被告传票,传票。 5.【解剖学】(动植物机体的)突起,隆起,突。 the process of growth 生长过程。 a mental [psychological] process 心理作用。 labour-consuming process 重体力劳动。 film process 影片加工。 offset process 胶印法。 legal process 法律手续。 vermiform process 【解剖学】阑尾,蚓突。 in process 进行着 (changes in process 正在发生的变化)。 in process of time 随着时间的推移;逐渐地。 in (the) process of 在…的过程中 (in process of construction 正在建筑中)。 serve a process on 对…发出传票。 adj. 1.经过特殊加工的;(用化学方法等)处理过的。 2.照相制版的;三色版的。 3.(电影镜头等)有幻觉效应的。 vt. 1.加工;处理,办理;初步分类;储藏(腌肉等);(用化学方法)处置(废物等)。 2.用照相版影印。 3.对…提起诉讼;用传票传审。 a processing tax 〔美国〕 (农产品)加工税。 a processing plant 炼油厂,石油加工厂。 vi. 〔口语〕排队走,列队行进 〔procession 之略〕。
Determining pinhole density in photoresist films used in microelectronic device processing 微电子器件加工过程用的光刻膜中针孔密度的测定
In this article , the application of medium pressure steam - stripping device process condensed liquid in the large ammonia plant was introduced . the analysis and discussion for the existing problems were , then , carried out 介绍大型氨厂中工艺冷凝液中压汽提装置的应用情况,对出现的问题进行了分析和探讨。
The device processing was introduced in detail , and the flow chart of processing was protracted . the device performance can be influenced by some specific processing steps , and the influence was carefully analyzed 详细介绍了制备器件的工艺流程并绘制工艺流程图,分析了其中一些具体工艺步骤对器件性能的影响。
In dwdm system , awg is the most promising wavelength multi / demultiplexer , and what influence the performance of awg most is the structure design and device processing . awg ' s performances are crosstalk , insertion loss , temperature shift and pdl ( polarization dependence loss ) 在dwdm系统中,阵列波导光栅( awgarrayedwaveguidegrating )是最具应用前景的波分复用解复用器,影响awg器件性能的关键因素是它的结构设计方案和工艺制作过程。
Considering the np - complete problem , how to get the approximate optimized scheme of job - shop scheduling , and aimed at improving the efficiency of products and taking good advantage of concurrence , asynchronism , distributing and juxtaposition in multi - products and devices processing , we could divide the working procedures into the attached one which has the only precursor and subsequence and unattached one by analyzing working flow chart of job - shop , that is the working procedures are divided into two types , then the bf and the ff methods about memory scheduling in os are applied , therefore a new approximate optimized scheme is presented in the paper which could solve the common job - shop scheduling . namely , the acpm and the bfsm are applied to the classified and grouped working procedures considering the compact of the procedures and practical examples approved it . the results we analyzing and tested show that it is better than the heuristic algorithm common used , for less restriction terms , more satisfying algorithm complexity and better optimized results 针对job - shop调度问题求最优解算法这一npc问题,本文以充分发挥多产品、多设备加工所具有并发性、异步性、分布性和并行性的加工优势,从而提高产品的加工效率为目标,对job - shop调度问题的工艺图进行适当分解,使工序在一定时间段或是为具有唯一紧前、紧后相关工序或是为独立工序,即将工序分两类,再结合操作系统中内存调度的最佳适应( bf )调度方法和首次适应( ff )调度方法的先进思想,通过分析提出了一种解决一般job - shop调度问题的全新近优解方案:在考虑关键设备上工序尽量紧凑的前提下,将工序分类、对这两类工序分批采用拟关键路径法( acpm )和最佳适应调度方法( bfsm )安排工序的算法,用实例加以验证,并给出结果甘特图。
In the paper the structure and principle of the secondary ion mass spectrometry ( sims ) are reported , and its typical applications in the hgcdte material and devices processing , especially in the measurement of the junction depth and the quantity analysis of trace impurity are introduced 摘要文章介绍了二次离子质谱仪的结构及其基本工作原理,并通过对典型应用的分析,介绍了二次离子质谱分析技术在高灵敏度碲镉汞红外焦平面探测器材料和器件制备工艺中的作用,特别是在结探监测和微量杂质监控方面所发挥的重要作用。
Metal impurities unintentionally introduced into si wafers during various device process steps are very harmful to device performances . many gettering techniques have been widely studied to overcome these problems by removing metal impurities from the active region of a device . reduction in device size and introduction of new moralization processes require more efficient gettering techniques working at lower temperatures 半导体工艺中无意引入的金属杂质的污染会极大损害器件性能,为了将金属杂质从器件的有源区吸除,吸杂技术被广泛的研究,器件尺寸的不断缩小和新的金属化工艺的不断出现更需要能在低温有效吸除的技术。